Search

    Language Settings
    Select Website Language

    GDPR Compliance

    We use cookies to ensure you get the best experience on our website. By continuing to use our site, you accept our use of cookies, Privacy Policy, and Terms of Service.

    BijnorNews
    Bijnor news

    iPhone Ultra Could Feature Redesigned Internal Layout as Purported Images of Motherboard Surface Online

    3 hours ago

    iPhone Ultra, Apple's first book-style foldable, will feature a redesigned internal layout, according to the leaked images of the phone's motherboard. The image of the phone’s motherboard shows the unreleased Apple Silicon A20 Pro chipset placed next to the DRAM, instead of being stacked on top of the chip. The A20 Pro chip and DRAM of the iPhone Ultra will reportedly be connected via a redistribution layer. Usually, the SoC and DRAM are stacked on top of each other with a conventional interposer. The redistribution layer is said to eliminate the need for an additional silicon interposer, as found on traditional designs, as it is built right into the package. This will reportedly help the foldable offer improved thermal performance.
    Click here to Read More
    Previous Article
    Tecno Spark Go 3 Pro India Launch Date, Design, Key Features Leaked Online
    Next Article
    वायरल वीडियो से उठे सवाल: क्या फ्री के चक्कर में लोग एक्सपायरी चॉकलेट भी खाने को तैयार हैं? जानें इसके गंभीर खतरे

    Related Tech Updates:

    Are you sure? You want to delete this comment..! Remove Cancel

    Comments (0)

      Leave a comment